Yeah! That's what I would have liked to have seen used as a basis for the new covers!

That is a de-capped or de-lidded IC part, in 1977 likely an SOIC package. No idea what part or what functions it does, but it looks fairly basic. I worked with die like these in plastic packages like this for over 40 years so I've looked at pictures like these for a long time. If you Goggle de-capped IC, you can see a bunch of interesting packages after the plastic is removed. Here is an article on the process: Delid and Decap FWIW, this is what it probably look like before it was de-lidded: The Goggle image search for "decapped IC" gets some interesting ones. I think the two chip package looks interesting. We produced quite a few of the dual-die packaged parts. They were sometimes difficult to manufacture. This photo below shows a closer shot of the bond wires connecting the die to the leads of the package. These are called "reverse ball bonds" because they start on the die with a smushed ball and end on the package lead. In the old days, the bond started on the package lead and end on the die. It's funny because today, almost all bonding is done using "reverse" ball bonds. Today, a bond starting on the lead is really the reverse process. The stuff that goes into this manufacturing process is the work of textbook after textbook. Everything from the "glue" holding the die down to the material it's glued down onto comes into play with functionality & reliability. The wires themselves are usually gold but they'll also use aluminum & copper (usually coated with Palladium) depending on the function of the part.  

It does appear to be working quickly right now, so maybe the server company was able to do something about the spambots?