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Miles Davis Live at the Plugged Nickel

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By hbbfam
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JSngry Grand Master

JSngry

Posted
Posted
53 minutes ago, Rooster_Ties said:

Those might be THE most whack examples of cover art in the entire ‘legit’ Miles catalog.

1976 and American Columbia wasn't interested for a while. There was no Second Great Quintet yet.

Guy Berger Collaborator

Guy Berger

Posted
Posted

Imho the 1965 Plugged Nickel recordings, while wonderful, are inferior in musical quality to the 1967 live recordings from Newport and Europe.

My guess is their reputation is largely based on the fact that for a long time they (and Miles in Berlin) were the only widely circulating live recordings of this quintet.

jazzbo Grand Master

jazzbo

Posted
Posted

I have the repress of the Japanese set on gold disc. IMO it sounds better than the US cd set, and the Tower Records SACD set sounds a bit better than the Japanese. The edits really don't bother me.

Kevin Bresnahan Mentor

Kevin Bresnahan

Posted
Posted

According to Sony's marketing blurb, "This new 10LP edition mirrors the original sequence, cut from the high-res Mosaic masters". Mosaic was AAA by this time, so this doesn't make sense.

I asked Scott Wenzel (via Facebook) if maybe the analog master tape they gave them to use for their LP set was digitally mastered and he said, "I'm not sure exactly how it was transferred and restored, only that, yes, we used analog masters".

So if Sony gave them an analog master tape created from a digital mix, they weren't above board with Mosaic. Considering Sony did the same thing to Mobile Fidelity albeit at a much larger scale, I wouldn't be surprised.

FWIW, he also implied that Mosaic would have liked to have been involved with this repress of their 10 LP set but that Sony isn't allowing them to license anything at this time.

jazzbo Grand Master

jazzbo

Posted
Posted
21 minutes ago, medjuck said:

What is that?  The Japanese release?  I don't recall ever seeing it. 

Yes, one of the original LP releases' cover.

Stompin at the Savoy Proficient

Stompin at the Savoy

Posted
Posted
6 hours ago, Kevin Bresnahan said:

According to Sony's marketing blurb, "This new 10LP edition mirrors the original sequence, cut from the high-res Mosaic masters". Mosaic was AAA by this time, so this doesn't make sense.

I asked Scott Wenzel (via Facebook) if maybe the analog master tape they gave them to use for their LP set was digitally mastered and he said, "I'm not sure exactly how it was transferred and restored, only that, yes, we used analog masters".

So if Sony gave them an analog master tape created from a digital mix, they weren't above board with Mosaic. Considering Sony did the same thing to Mobile Fidelity albeit at a much larger scale, I wouldn't be surprised.

FWIW, he also implied that Mosaic would have liked to have been involved with this repress of their 10 LP set but that Sony isn't allowing them to license anything at this time.

Whoa, this is starting to sound like a real mastering mess!  They are going to have to clarify the sources they are using before I would consider a new "remaster".

JSngry Grand Master

JSngry

Posted
Posted
1 hour ago, medjuck said:

What is that?  The Japanese release?  I don't recall ever seeing it. 

Those two records are the beginning of the concept of The Second Great Quintet as a thing. Nobody was thinking about that group as a live band, not yet. It was those two records that got the ball rolling. In 1976, after Miles was retired and after how many evolutions, and who was thinking about a 10 year old club date shaking up the world?

But the they were.

You could get them if you had a contact for Japanese records. I got mine in 1981 (after after hearing them fou a few years)  at Jazz Record Mart, but I had to order a week in advance, such was the ongoing demand. 

5 minutes ago, Daniel A said:

And what is it? An IC board?

That's been the consensus as I have heard it.

Kevin Bresnahan Mentor

Kevin Bresnahan

Posted
Posted
4 hours ago, Daniel A said:

And what is it? An IC board?

That is a de-capped or de-lidded IC part, in 1977 likely an SOIC package. No idea what part or what functions it does, but it looks fairly basic. I worked with die like these in plastic packages like this for over 40 years so I've looked at pictures like these for a long time.

If you Goggle de-capped IC, you can see a bunch of interesting packages after the plastic is removed. Here is an article on the process: Delid and Decap

FWIW, this is what it probably look like before it was de-lidded:

Review of the SOIC 2-Way Direction IC Package – HIGH-END FPGA Distributor

The Goggle image search for "decapped IC" gets some interesting ones. I think the two chip package looks interesting. We produced quite a few of the dual-die packaged parts. They were sometimes difficult to manufacture.

Decapped BMS chips

This photo below shows a closer shot of the bond wires connecting the die to the leads of the package. These are called "reverse ball bonds" because they start on the die with a smushed ball and end on the package lead. In the old days, the bond started on the package lead and end on the die. It's funny because today, almost all bonding is done using "reverse" ball bonds. Today, a bond starting on the lead is really the reverse process. :)

Decapping and Chip-Documentation - Howto

The stuff that goes into this manufacturing process is the work of textbook after textbook. Everything from the "glue" holding the die down to the material it's glued down onto comes into play with functionality & reliability. The wires themselves are usually gold but they'll also use aluminum & copper (usually coated with Palladium) depending on the function of the part.

 

JSngry Grand Master

JSngry

Posted
Posted
17 minutes ago, Kevin Bresnahan said:

That is a de-capped or de-lidded IC part, in 1977 likely an SOIC package. No idea what part or what functions it does, but it looks fairly basic. I worked with die like these in plastic packages like this for over 40 years so I've looked at pictures like these for a long time.

If you Goggle de-capped IC, you can see a bunch of interesting packages after the plastic is removed. Here is an article on the process: Delid and Decap

FWIW, this is what it probably look like before it was de-lidded:

Review of the SOIC 2-Way Direction IC Package – HIGH-END FPGA Distributor

The Goggle image search for "decapped IC" gets some interesting ones. I think the two chip package looks interesting. We produced quite a few of the dual-die packaged parts. They were sometimes difficult to manufacture.

Decapped BMS chips

This photo below shows a closer shot of the bond wires connecting the die to the leads of the package. These are called "reverse ball bonds" because they start on the die with a smushed ball and end on the package lead. In the old days, the bond started on the package lead and end on the die. It's funny because today, almost all bonding is done using "reverse" ball bonds. Today, a bond starting on the lead is really the reverse process. :)

Decapping and Chip-Documentation - Howto

The stuff that goes into this manufacturing process is the work of textbook after textbook. Everything from the "glue" holding the die down to the material it's glued down onto comes into play with functionality & reliability. The wires themselves are usually gold but they'll also use aluminum & copper (usually coated with Palladium) depending on the function of the part.

 

Yeah!

That's what I would have liked to have seen used as a basis for the new covers!

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